Polymerized using the TERP method: TERPLUS adhesive
With advanced molecular weight control within the high molecular weight domain, the TERPLUS series of adhesives contributes to the development of a uniform network, and has many different applications to address low contamination, thermal durability, stress relaxation, elastic modulus control and other needs.
Solution
TERPLUS adhesives contain a small number of low molecular weight ingredients and have low contamination and heat resistance features in the applications where they are needed.
With its advanced molecular weight control within the high molecular weight domain, the TERPLUS series of adhesives contributes to the development of a uniform network and makes it possible to design products with low contamination, heat resistance, stress relaxation and elastic modulus features.
Features
Low contamination
Controlling the molecular weight distribution reduces oligomer ingredients in the low molecular weight domain and prevents glue from remaining on the adherend.
Heat resistance
Controlling the molecular weight distribution enables the formation of a rubber-like planarization area in a wide range of temperatures, from low to high.
Elastic modulus
Controlling the molecular weight distribution enables the formation of
a rubber-like planarization area in a wide range of temperatures, from low to high.
General Properties
Representing Grade Characteristics
Characteristics | Basic properties | |||||||
---|---|---|---|---|---|---|---|---|
Slight adhesion |
adhesion |
Strong |
Heat resistance | Acid free | High concentration | Solid content | ||
100-001 | ⚫︎ | ⚫︎ | 15-25 | AcOEt | ||||
100-002 | ⚫︎ | ⚫︎ | 20-30 | AcOEt | ||||
100-007 | ⚫︎ | ⚫︎ | ⚫︎ | 40-50 | AcOEt | |||
200-001 | ⚫︎ | ⚫︎ | ⚫︎ | 15-25 | AcOEt | |||
200-002 | ⚫︎ | ⚫︎ | ⚫︎ | ⚫︎ | ⚫︎ | 17-27 | AcOEt | |
200-004 | ⚫︎ | ⚫︎ | ⚫︎ | ⚫︎ | 30-40 | AcOEt | ||
300-001 | ⚫︎ | ⚫︎ | 15-25 | AcOEt | ||||
300-003 | ⚫︎ | ⚫︎ | ⚫︎ | 40-50 | AcOEt | |||
300-004 | ⚫︎ | ⚫︎ | ⚫︎ | 30-40 | AcOEt |
Achievements
Process tape for electronic materials
- Molecular weight control in macromolecular domains enables durability in the high temperature range
- The polymer has a small number of low molecular weight ingredients, which reduces adherend contamination resulting from glue residue