We take on the challenge of finding new possibilities in film offering low coefficient of thermal expansion and high hardness
This series of Poticon features a unique scale-like filler that is compounded into thermoplastic
resins to create films offering low coefficient of expansion, high hardness, and excellent
recyclability.
Solution
This series of compounds utilizes a unique scale like filler in thermoplastic resins to provide
advanced folding strength, high hardness, and superior insulation performance in film and sheet
materials. Given the low coefficient of expansion, the excellent adhesion to metal and fabricating
materials, and the flexibility of the substrate, these compounds are suitable for a wide range of
applications.
Advantages
- High Hardness, Fold Strength, Surface Smoothness
- Recyclability, Low Coefficient of Expansion
- Thermoplasticity, Ease of Secondary Processing
- Heat Resistance (60 sec. at 260˚C)
- Excellent Dielectric Properties
- Low Thermal Adhesion 250˚C
General Properties
| Polymer | PA12 | PEI | PEEK | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Unit | Test method | ||||||||
| Filler contents | % | - | - | 0 | 15 | 0 | 15 | 0 | 15 |
| Coefficient of linear thermal expansion |
X10-5/°C | TMA （30〜100°C） |
|||||||
| TD | 16~17 | 13~14 | 5.2~6.4 | 3.3~3.9 | 6.0~7.4 | 3.6~4.6 | |||
| Tensile strength | MPa | JIS Z1702 | MD | 21 | 28 | 110 | 104 | 62 | 74 |
| TD | - | 27 | - | 88 | 64 | 55 | |||
| Tensile strength Elongation at break | % ( ) at yield |
MD | (5.5) | (5.7) | 19.4 | 4.8 | (5.0) | 4.4 | |
| TD | - | (6.0) | - | 5.0 | (5.1) | 4.1 | |||
| Young's modulus | GPa | JIS Z1702 MD JIS K7161 | MD | 0.9 | 1.8 | 3.0 | 5.3 | 2.3 | 5.0 |
| TD | - | 1.7 | - | 4.9 | 2.3 | 4.4 | |||
| Right angled tear strength | MPa | JIS K7128-3 | MD | 11.5 | 12.7 | 11.0 | 14.6 | 12.5 | 15.8 |
| TD | - | 12.3 | 11.4 | 8.2 | 12.4 | 13.0 | |||
| Right angled tear strength Elongation at break | % | MD | 15.8 | 12.1 | 2.1 | 1.8 | 4.1 | 3.3 | |
| TD | - | 11.6 | 2.0 | 0.9 | 3.8 | 2.8 | |||
| Dielectric Constant (at 3GHz) |
- | Cavity Resonator Method | MD | 2.7 | 2.9 | 3.0 | 3.1 | 3.1 | 3.3 |
| TD | 2.7 | 2.9 | 2.9 | 2.9 | 3.2 | 3.2 | |||
| Dielectric Loss (at 3GHz) |
- | MD | 0.015 | 0.014 | 0.004 | 0.006 | 0.004 | 0.003 | |
| TD | 0.014 | 0.014 | 0.004 | 0.006 | 0.004 | 0.003 | |||
Applications
-
Insulation Sheets, Belts, Tubing
-
Speaker diaphragm
-
Multi-layer foundation materials
-
Cover-lay
-
Flexible connective base materials
