High-order stable, permanent conductive high-tech composite materials
Whistatt offers exceptionally stable and uniform chemical and physical conductivity. When used as an anti-static or resistance agent, the material allows for flexible electrical system design.
Solution
WHISTATT is a series of conductive compounds that feature Otsuka Chemical’s conductive filler DENTALL
These compounds provide the same superior sliding and microscopic reinforcement as
our Poticon series, with the added benefit of conductivity or anti-static properties. The three
dimensional net-like structure of Whistatt’s conductive bypass delivers extremely stable and
uniform conductivity.
Advantages
- Uniform Stable Conductivity
- Wide selectivity of conductivity
- Superior Conductive Stability in Thermal Environment
- Micro-reinforcement
- Superior friction sliding and wear reduction
General Properties
| Polymer | PPS | ||||
|---|---|---|---|---|---|
| Grade | RFKB-9 | RBA313N | RBA514 | ||
| Unit | Test method | ||||
| Water absorption rate | % | D570 | 0.02 | 0.02 | 0.02 |
| Tensile strength | MPa | D638 | 50 | 49 | 78 |
| Elongation at break | % | D638 | 1.2 | 1.6 | 2.2 |
| Flexural strength | MPa | D790 | 68 | 69 | 120 |
| Flexural modulus | GPa | D790 | 5.1 | 5.4 | 7.1 |
| Izod impact strength | J/m (notched) | D256 | 30 | 25 | 25 |
| Coefficient of kinetic friction | *Otsuka method | 0.22 | 0.18 | 0.20 | |
| Specific abrasion volume | ×10-1mm3/N・km | 0.021 | 0.01 | 0.020 | |
| Specific abrasion of counterpart | ×10-1mm3/N・km | 0 | 0 | 0 | |
| Heat distortion temperature | °C | D648 | 213 | 220 | 218 |
| Flammability | UL94 | V-0 | V-0 | V-0 | |
| Volume resistivity rate | Ωm | D257 | 104 | 102 | - |
＊Otsuka method : This Size is measured size of 90×50×3 mm molded item by vernier caliper
Applications
- Silicon Wafer Basket
-
IC Tray
- OA（Gears）
