Resin crosslinking agents and corrosion inhibitors
These agents are used as latent curing agents for epoxies in product categories such as paint and adhesives and as crosslinking agents for acrylic emulsions containing ketone groups. Post-curing properties can be controlled by changing the hydrazide compound used.
Due to hydrazine’s reduction properties, these agents are used as metal reductants and chelate agents in semiconductor and other applications.
Solution
Epoxy resin curing agent
The agent has high one-component storage stability and its post-curing properties can be controlled by changing the curing agent selected.
Acrylic resin crosslinking agent
The crosslinking agent for acrylic paint helps increase coating strength and enables crosslinking when drying at room temperature.
Corrosion inhibitors
Due to hydrazine’s superior reduction properties, corrosion inhibitors are used as metal reductants and chelate agents in semiconductor and other applications.
General Properties
Product | Unit | Adipic dihydrazide | Sebacic dihydrazide | Dodecanediohydrazide | Isophthalic dihydrazide |
---|---|---|---|---|---|
Molecular weight | 174.2 | 230.3 | 258.4 | 194.2 | |
Appearance | White crystalline | White crystalline | White crystalline | Whitish crystalline | |
Melting point | °C | 177 ~ 183 | 186 ~ 188 | 188 ~ 192 | 215 ~ 225 |
Applications
Automobile structural adhesives, adhesives for electronic materials and powder paints (epoxies)
These agents have high one-component storage stability and their post-curing properties can be controlled by changing the curing agent selected.
Aqueous acrylic paints
The DAAM/ADH crosslinking system can retain its emulsion stability for a long time.The polymers generated by DAAM/ADH can be expected to enhance the membrane properties of paints.
Corrosion inhibitors
Corrosion inhibitors are used as additives in chemicals used in the process of manufacturing electronic components, such as CMP slurries, semiconductor detergents and solders.
Achievements
- Epoxy adhesives for automobile structure
- Epoxy adhesives for electronic materials
- Epoxy powder paints
- Aqueous acrylic paints
- CMP slurries
- Semiconductor detergents
- Solders