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POTICON for FilmThermoplastic compounds

We take on the challenge of finding new possibilities in film offering low coefficient of thermal expansion and high hardness

This series of Poticon features a unique scale-like filler that is compounded into thermoplastic resins to create films offering low coefficient of expansion, high hardness, and excellent recyclability.

Summary

This series of compounds utilizes a unique scale like filler in thermoplastic resins to provide advanced folding strength, high hardness, and superior insulation performance in film and sheet materials. Given the low coefficient of expansion, the excellent adhesion to metal and fabricating materials, and the flexibility of the substrate, these compounds are suitable for a wide range of applications.

Advantages

  1. High Hardness, Fold Strength, Surface Smoothness
  2. Recyclability, Low Coefficient of Expansion
  3. Thermoplasticity, Ease of Secondary Processing
  4. Heat Resistance (60 sec. at 260˚C)
  5. Excellent Dielectric Properties
  6. Low Thermal Adhesion 250˚C

Applications

  • Insulation Sheets, Belts, Tubing
  • Speaker diaphragm
  • Multi-layer foundation materials
  • Cover-lay
  • Flexible connective base materials

Dielectric properties of POTICON for Film

General Properties

Polymer
PA12
PEI
PEEK
Unit
Test method
Filler contents
%
-
- 0 15 0 15 0 15
Coefficient of linear thermal expansion
×10-5/°C
TMA (30 ~ 100°C)
MD 20 ~ 21 12 ~ 13 5.6 ~ 6.6 2.4 ~ 3.2 6.1 ~ 7.2 2.7 ~ 3.3
TD 16 ~ 17 13 ~ 14 5.2 ~ 6.4 3.3 ~ 3.9 6.0 ~ 7.4 3.6 ~ 4.6
Tensile strength
MPa
JIS Z1702
MD 21 28 110 104 62 74
TD - 27 - 88 64 55
Tensile strength Elongation at break
% ( )at yield
MD (5.5) (5.7) 19.4 4.8 (5.0) 4.4
TD - (6.0) - 5.0 (5.1) 4.1
Young's modulus
GPa
JIS Z1702 JIS K7161
MD 0.9 1.8 3.0 5.3 2.3 5.0
TD - 1.7 - 4.9 2.3 4.4
Right angled tear strength
MPa
JIS K7128-3
MD 11.5 12.7 11.0 14.6 12.5 15.8
TD - 12.3 11.4 8.2 12.4 13.0
Right angled tear strength Elongation at break
%
MD 15.8 12.1 2.1 1.8 4.1 3.3
TD - 11.6 2.0 0.9 3.8 2.8
Dielectric Constant (at 3GHz)
-
Cavity Resonator Method
MD 2.7 2.9 3.0 3.1 3.1 3.3
TD 2.7 2.9 2.9 2.9 3.2 3.2
Dielectric Loss (at 3GHz)
-
MD 0.015 0.014 0.004 0.006 0.004 0.003
TD 0.014 0.014 0.004 0.006 0.004 0.003